SPU / Sheet Manufacturing Bank Monitoring System
Features of Bank Monitor
Even small banks hard to see can be measured precisely, and positional relationship with T-die adjust bolt can be displayed simply.
- As a bank profile near the T-die is measured, the result of T-die adjustment is displayed instantly for speedy adjustment of the same die.
- It is possible to foresee and adjust the bank before a bank mark or shrinkage generates on it by the output of an upper or lower bank size limit alarm during production.
Melt bank monitoring system (BM)
It is possible to monitor small banks often invisible and adjust them quickly.
Principle of measurement
If bank size (H) is large, contact length (l) becomes longer with decrease in sheet surface temperature (T). This relationship is obtained by numerical analysis to figure out the bank size based on the measured temperature.
| Bank size: H | Between Bank~Roll | Sheet surface temperature at A | |
|---|---|---|---|
| Contact length: L | Heat exchange duty | ||
| Big | Long | Large | Low |
| Small | Short | Small | High |