Technical Seminar Information

The 13th Toshiba Machine Group Solution Fair 2015 ended. Thank you for coming.

Technical seminar

May 21 (Thu)

 Venue/Time Hall 1
Reception & Meeting Area
Hall 3
#1 Technical Center
Hall 8
#15 Factory
Hall 10
Gotemba Plant
A B C  
10:00 -10:30 Nano Processing System Division
The Leading Edge of Milling Technology “What is the Future Demand of Machining Technology?”
   

Machine Tools Division
13:00-13:30
Shortening of Die Molding Manufacturing Time

13:45-14:15
Introduction of Hybrid Slide guide of New Hydrostatic and Hydrodynamic Technologies

 

10:45 -11:15 TOSHIBA MACHINE ENGINEERING CO., LTD.
Ink-Jet Decoration System ~ Why Ink-Jet? ~
Injection Molding Machine Division
Introduction of Small Sized New Series EC-SXII and Large Sized New Model EC1800SX
Die Casting Machine Division
Introduction of Semi-Solid Die-Casting System
14:45 -15:15 Extrusion Machine Division
Toshiba Machine’s Simultaneous Bi-Axially Oriented Film Manufacturing Machine Responding to Demands of Value Added Highly Functionality and High Quality
Injection Molding Machine Division
Introduction of Molding Technology Contributing to CFRP and Lightweighting
Control Systems Division
Proposal of Toshiba Machine’s Smart Solution Utilizing IoT

May 22 (Fri)

 Venue/Time Hall 1
Reception & Meeting Area
Hall 3
#1 Technical Center
Hall 8
#15 Factory
Hall 10
Gotemba Plant
A B C  
10:00 -10:30 Control Systems Division
Picking Workpieces from Random Pile Using 3D Vision
   Engineering and Quality Division
Approach to Quality Stabilization of Cast Iron

Machine Tools Division
13:00-13:30
Introduction of Hybrid Slide guide of New Hydrostatic and Hydrodynamic Technologies

13:45-14:15
Shortening of Die Molding Manufacturing Time
10:45 -11:15 Injection Molding Machine Division
Introduction of Molding Technology Contributing to CFRP and Lightweighting
  FUJI SEIKI MACHINE WORKS, LTD.
Introduction of Drilling Center FMC Series
14:45 -15:15 Extrusion Machine Division
Twin-Screw Extruder Approach toward High Functionality
Injection Molding Machine Division
Introduction of Small Sized New Series EC-SXII and Large Sized New Model EC1800SX
Die Casting Machine Division
Influence of Casting Conditions on Molten Metal Behavior and Product Quality

May 23 (Sat)

 Venue/Time Hall 1
Reception & Meeting Area
Hall 3
#1 Technical Center
Hall 8
#15 Factory
Hall 10
Gotemba Plant
A B C  
10:00 -10:30 Nano Processing System Division
Advanced Ultra-Precision Machine Tool “ULG/ULC”
 Injection Molding Machine Division
Introduction of Molding Technology Contributing to CFRP and Lightweighting
 Control Systems DivisionPicking Workpieces from Random Pile Using 3D Vision Machine Tools Division
13:00-13:30
Shortening of Die Molding Manufacturing Time


13:45-14:15
Introduction of Hybrid Slide guide of New Hydrostatic and Hydrodynamic Technologies
45 -11:15 Control Systems Division
Proposal of Toshiba Machine’s Smart Solution Utilizing IoT
 

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