NEPCON JAPAN 2022 – 36th Electronics R&D, Manufacturing and Packaging Technology Expo
Dec. 2, 2021
Interactive period | January 19 (Wed) –21 (Fri), 2022 10:00-18:00 ※Last day until 17:00 |
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Venue | Tokyo Big Sight Japan |
Access |
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Exhibition Overview
SHIBAURA MACHINE CO., LTD. will exhibit at「NEPCON JAPAN 2022 – 36th Electronics R&D, Manufacturing and Packaging Technology Expo」at Tokyo Big Sight from January 19 (Wed) –21 (Fri), 2022 10:00-18:00 (Last day until 17:00).
The concept of this time is 【New film formation technology that supports next-generation high-speed communication.】
We would appreciate it if you could come to our booth.
Exhibition Content
【Sample】
- The overview of plainting seed layer fabrication machine
- Fine pitch pattern circuit using sputtering seed layer
- Double-sided film on rigid substrate by sputtering
- The circuit on glass substrate
- Decrated tea cup by sputtering
【Explanation panel】
- The merit of direct sputterring seed layer
- The explaine of semi addtive methid, and the appriation
- The explaine of exhibits
- Company introduction
Exhibition Booth
- Tokyo Big Sight (East Hall 1F 11-38)
Related Links
NEPCON JAPAN 2022 – 36th Electronics R&D, Manufacturing and Packaging Technology Expo