NEPCON JAPAN 2022 – 36th Electronics R&D, Manufacturing and Packaging Technology Expo

Dec. 2, 2021

NEPCON JAPAN 2022 – 36th Electronics R&D,  Manufacturing and Packaging Technology Expo
Interactive period January 19 (Wed) –21 (Fri), 2022 10:00-18:00
※Last day until 17:00
Venue Tokyo Big Sight Japan
Access

Exhibition Overview

 SHIBAURA MACHINE CO., LTD. will exhibit at「NEPCON JAPAN 2022 – 36th Electronics R&D, Manufacturing and Packaging Technology Expo」at Tokyo Big Sight from January 19 (Wed) –21 (Fri), 2022 10:00-18:00 (Last day until 17:00). 
 The concept of this time is 【New film formation technology that supports next-generation high-speed communication.】

 We would appreciate it if you could come to our booth.

Exhibition Content

【Sample】

  • The overview of plainting seed layer fabrication machine
  • Fine pitch pattern circuit using sputtering seed layer
  • Double-sided film on rigid substrate by sputtering
  • The circuit on glass substrate
  • Decrated tea cup by sputtering

【Explanation panel】

  • The merit of direct sputterring seed layer
  • The explaine of semi addtive methid, and the appriation
  • The explaine of exhibits
  • Company introduction

Exhibition Booth

  • Tokyo Big Sight (East Hall 1F 11-38)

Related Links

NEPCON JAPAN 2022 – 36th Electronics R&D, Manufacturing and Packaging Technology Expo

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